Product Spotlight - BSL8072

Planar Solutions BSL8072 is an advanced non-selective copper barrier CMP slurry, with tunable removal rate selectivities to meet a wide variety of customer process requirements and integration schemes. Low-K dielectric removal rates can be varied over an extensive range to meet various oxide loss targets. This product exhibits excellent topography correction and is compatible with a wide variety of hard and soft polish pads. The use of ultra pure colloidal silica allows for exceptionally low trace metal contamination and defectivity, intended to meet the requirements of the most advanced applications.