Copper Barrier CMP Slurries

All FUJIFILM Planar Solutions copper barrier layer slurries are low-selective products, designed to remove exposed barrier metal following the copper clearing step as well as a portion of the inter-metal dielectric. Versions of the Cu10K-series product line have been in high volume production use since 2000. Our barrier slurries offer outstanding corrosion protection for sensitive copper features and are compatible with a wide range of integration schemes including low-K dielectrics, etch hard masks, and ARC layers.

Available Copper Barrier CMP Slurries:

  • BSL8176C
    BSL8176C is a concentrated version of FUJIFILM Planar Solutions’ commercially-successful BSL8072 advanced barrier slurry. Like BSL8072, this product offers a wide range of material removal tuneability and ultra-low defectivity but at a lower cost of ownership. BSL8176C requires the addition of DI water and hydrogen peroxide at the customer’s site prior to use.

  • BSL8072
    BSL8072 is FUJIFILM Planar Solutions’ advanced barrier slurry, offering full tuneability for all material removal rate selectivities including low-k. This product exhibits very low defectivity for compatibility with leading edge device technologies, and can be used with a wide variety of soft and hard CMP pads. The topography correction capability of this product is excellent. BSL8072 is compatible with a wide variety of process integration schemes.

  • Cu10K-SPF
    Cu10K-SPF is a lower defectivity version of Cu10K-2, the original industry-standard low-selectivity copper barrier slurry. When used on soft polish pads, this product provides good topography correction and low defectivity and has been used in high volume production as low as the 65nm technology node. A ready-to-use product, Cu10K-SPF is currently being replaced at most customer sites by concentrated versions Cu18K and Cu20K-TC for reduced cost of ownership.

  • Cu18K and Cu20K-TC
    Cu18K and Cu20K-TC are concentrated barrier slurries based on Cu10K-SPF for reduced cost of ownership. Performance is designed to be equivalent to Cu10K-SPF after dilution with similar or slightly improved defectivity. Cu18K requires only the addition of DI water at the customer’s site prior to use while Cu20K-TC also requires the addition of hydrogen peroxide.