Copper CMP Slurries

All Planar Solutions copper slurries are designed for the thinning and clearing of copper overfill to expose underlying damascene interconnects. All products have a similar neutral-pH formulation that provides outstanding corrosion protection and extremely high removal selectivity to barrier metal. These slurries are compatible with most integration schemes including those utilizing low-k and ultra low-K dielectrics. Cost of ownership is very attractive due to highly concentrated product formulations. No pad rinse chemicals are required, simplifying the CMP process. Several products are available to meet the performance requirements for all copper technology nodes.

Available Copper CMP Slurries:

• CSL9044C
  Developed to provide performance suitable for leading edge copper-based circuits, this product provides high removal rates to maximize process throughput, very low defectivity, and very good copper clearing capability. Topography following copper clear is exceptionally low with minimal dishing and erosion. Depending on the topography requirements, this product may be used for technology nodes ranging from 130nm through 45nm.
• CSL9042C
  Developed to provide performance suitable for 2nd and 3rd generation copper-based circuits. This product provides high removal rates to maximize process throughput, very low defectivity, and very good copper clearing capability. Topographical performance is improved over CSL9041C.
• CSL9041C
  Developed to provide performance suitable for 1st and 2nd generation copper-based circuits. This product provides very high removal rates to maximize process throughput, low defectivity, and very good copper clearing capability. Topographical performance is appropriate for mature copper technology nodes.