CMP Slurry Introduction

Chemical mechanical planarization (CMP) is a critical process in the fabrication of advanced semiconductor devices or “microchips” used in today’s electronics. CMP is used to smooth the surface of films on silicon wafers and remove excess film to reveal underlying features. CMP is typically employed multiple times throughout the microchip manufacturing process as layers of device circuitry are built. CMP impacts the performance and reliability of microchips as well as the number of acceptable microchips that can be obtained from a wafer (“yield”). As feature sizes on microchips have become smaller, CMP has taken on an increasingly critical role. Planar Solutions offers products for use in technology nodes ranging from mature technologies to the most advanced. Our products allow our customers to achieve high product yields and reliability at an attractive cost of ownership. Because technical performance requirements can differ by application, Planar Solutions offers a wide variety of products, many with the ability to be tuned for specific requirements.

Please click on a link at the left to view our available products by process application.