Technology

• Multiple patents awarded for copper and barrier slurry technologies including single-component slurries
• Multiple technical publications in the area of CMP slurries and process development
• Proprietary semi-continuous dispersion and slurry manufacturing technology
• High purity, high quality colloidal silica base dispersions
• Tunable barrier slurry chemistry technology for metal and low-K dielectric films
• Advanced slurry filtration technology
• Capability to rapidly scale-up developmental products to high-volume production
• Fully-equipped CMP applications lab in Mesa, Arizona USA with 200mm and 300mm capability
• Advanced chemical analysis methods to ensure product quality